HZS
HZS

Dowsil

DOWSIL™ TC-5026 Thermally Conductive Compound


　　Designed to provide efficient thermal transfer for the cooling of MPU in servers,desktops,notebooks,and game consoles.

Properties

These values are not intended for use in preparing specifications.

Typical Properties

  • ColorGray
  • Dielectric Strength227 volts per mil v/mil
  • FlowableYes
  • Non-CuringYes
  • Nonvolatile Content99.95 %
  • Number of PartsOne
  • Resistance TypeThermal Resistance
  • Shelf Life712 Days
  • SolventlessYes
  • Specific Gravity3.5
  • Thermal Conductivity2.9 W/m・K
  • Thermal Resistance at 40 psi0.03 Deg C-cm2/W
  • Viscosity100000 mPa.s
  • Volume Resistivity5.9e+011 Ω・cm

Features

    　　●  Solventless formulation
    　　●  Flowable
    　　●  Non-curing–no need for curing ovens
    　　●  Capable of achieving thin Bond Line Thickness for optimum performance
    　　●  Very low thermal resistance
    　　●  High thermal conductivity
    　　●  Conducts heat away from sensitive components

Typical Properties

Looking for additional technical specifications. Download a Product Datasheet in our Resource Library or talk with our technical experts.

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Looking for additional technical specifications. Download a Product Datasheet in our Resource Library or talk with our technical experts.

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